ZHCSO96B June 2021 – June 2022 DAC12DL3200
PRODUCTION DATA
| THERMAL METRIC(1) | DAC12DL3200 | UNIT | |
|---|---|---|---|
| ACF or ALJ (FCBGA) | |||
| 256 BALLS | |||
| RΘJA | Junction-to-ambient thermal resistance | 16.7 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 1.1 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 5.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 5.5 | °C/W |