ZHCSLB8C May 2020 – May 2021 LMH9235
PRODUCTION DATA
| THERMAL METRIC(1) | LMH9235 | UNIT | |
|---|---|---|---|
| RRL PKG | |||
| 12-PIN WQFN | |||
| RθJA | Junction-to-ambient thermal resistance | 74.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 72.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 3.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 37.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 14.2 | °C/W |