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ZHCSGU8E June 2017 – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.

封裝選項

請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。

機械數(shù)據(jù) (封裝 | 引腳)

散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)

訂購信息

6.8 Safety Limiting Values

Safety limiting⁽¹⁾ intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.

PARAMETER		TEST CONDITIONS	MAX	UNIT
ISO1211
I_S	Safety input, output, or supply current - side 1	R_θJA = 146.1°C/W, V_I = 2.75 V, T_J = 150°C, T_A = 25°C, see Figure 1	310	mA
		R_θJA = 146.1°C/W, V_I = 3.6 V, T_J = 150°C, T_A = 25°C, see Figure 1	237
		R_θJA = 146.1°C/W, V_I = 5.5 V, T_J = 150°C, T_A = 25°C, see Figure 1	155
I_S	Safety input current - field side	R_θJA = 146.1°C/W, V_I = 24 V, T_J = 150°C, T_A = 25°C, see Figure 1	35	mA
		R_θJA = 146.1°C/W, V_I = 36 V, T_J = 150°C, T_A = 25°C, see Figure 1	23
		R_θJA = 146.1°C/W, V_I = 60 V, T_J = 150°C, T_A = 25°C, see Figure 1	14
P_S	Safety input, output, or total power	R_θJA = 146.1°C/W, T_J = 150°C, T_A = 25°C, see Figure 2	855	mW
T_S	Maximum safety temperature		150	°C
ISO1212
I_S	Safety input, output, or supply current - side 1	R_θJA = 116.9°C/W, V_I = 2.75 V, T_J = 150°C, T_A = 25°C, see Figure 3	389	mA
		R_θJA= 116.9°C/W, V_I = 3.6 V, T_J = 150°C, T_A = 25°C, see Figure 3	297
		R_θJA = 116.9°C/W, V_I = 5.5 V, T_J = 150°C, T_A = 25°C, see Figure 3	194
I_S	Safety input current - field side	R_θJA = 116.9°C/W, V_I = 24 V, T_J = 150°C, T_A = 25°C, see Figure 3	44	mA
		R_θJA= 116.9°C/W, V_I = 36 V, T_J = 150°C, T_A = 25°C, see Figure 3	29
		R_θJA = 116.9°C/W, V_I = 60 V, T_J = 150°C, T_A = 25°C, see Figure 3	17
P_S	Safety input, output, or total power	R_θJA = 116.9°C/W, T_J = 150°C, T_A = 25°C, see Figure 4	1070	mW
T_S	Maximum safety temperature		150	°C

(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.