ZHCSGU8E June 2017 – August 2018 ISO1211 , ISO1212
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | ISO1211 | ISO1212 | UNIT | |
|---|---|---|---|---|
| D (SOIC) | DBQ (SSOP) | |||
| 8 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 146.1 | 116.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 63.1 | 56.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 80 | 64.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 9.6 | 27.9 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 79 | 64.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |