SBASB99 November 2025 AMC1200C
PRODUCTION DATA
| THERMAL METRIC(1) | DUB (SOIC) | UNIT | |
|---|---|---|---|
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 75.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 39.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 27.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 39.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |