SBASB99 November 2025 AMC1200C
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information?(DWV Package)
- 5.5 Thermal Information?(DUB Package)
- 5.6 Power Ratings
- 5.7 Insulation Specifications
- 5.8 Safety-Related Certifications
- 5.9 Safety Limiting Values (DWV Package)
- 5.10 Safety Limiting Values (DUB Package)
- 5.11 Electrical Characteristics
- 5.12 Switching Characteristics
- 5.13 Timing Diagram
- 5.14 Insulation Characteristics Curves
- 5.15 Typical Characteristics
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6.3.2 Isolation Channel Signal Transmission
As shown in Figure 6-1, the AMC1200C uses an on-off keying (OOK) modulation scheme to transmit the modulator output bitstream across the SiO2-based isolation barrier. The transmit driver (TX) is illustrated in the Functional Block Diagram. TX transmits an internally generated, high-frequency carrier across the isolation barrier to represent a digital one. However, TX does not send a signal to represent a digital zero. The nominal frequency of the carrier used inside the AMC1200C is 480MHz.
The receiver (RX) on the other side of the isolation barrier recovers and demodulates the signal and provides the input to the analog filter. The AMC1200C transmission channel is optimized to achieve the highest level of common-mode transient immunity (CMTI) and the lowest level of radiated emissions. The high-frequency carrier and RX/TX buffer switching cause these emissions.
Figure 6-1 OOK-Based Modulation
Scheme