DAC7578
- Relative Accuracy:
- DAC5578 (8 bit): 0.25LSB INL
- DAC6578 (10 bit): 0.5LSB INL
- DAC7578 (12 bit): 1LSB INL
- Glitch Energy: 0.15nV-s
- Power-On Reset to Zero Scale or Midscale
- Devices in the TSSOP Package Reset to Zero Scale
- Devices in the QFN Package Reset to Zero Scale or Midscale
- Ultra-Low Power Operation: 0.13mA/ch at 5V
- Wide Power-Supply Range: +2.7V to +5.5V
- 2-Wire Serial Interface (I2C compatible)
- Temperature Range: –40°C to +125°C
- APPLICATIONS
- Portable Instrumentation
- Closed-Loop Servo Control
- Process Control
- Data Acquisition Systems
All other trademarks are the property of their respective owners
The DAC5578 (8 bit), DAC6578 (10 bit), and DAC7578 (12 bit) are low-power, voltage-output, octal channel, digital-to-analog converters (DACs). The devices are monolithic, provide good linearity,and minimize undesired code-to-code transient voltages (glitch).
The devices use a versatile, 2-wire serial interface that is I2C-compatible and operates at clock rates of up to 3.4MHz. Multiple devices can share the same bus.
The devices incorporate a power-on-reset (POR) circuit that ensures the DAC output powers up to zero-scale or midscale until a valid code is written to the device. These devices also contain a power-down feature, accessed through the serial interface, that reduces the current consumption of the devices to typically 0.42µA at 5V. Power consumption is typically 2.32mW at 3V, reducing to 0.68µW in power-down mode. The low power consumption and small footprint make these devices ideal for portable, battery-operated equipment.
The DAC5578, DAC6578, and DAC7578 are drop-in and functionally-compatible with the DAC7678. All devices are available in a 4x4, QFN-24 package and a TSSOP-16 package.
技術文檔
| 類型 | 標題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | 8/10/12-Bit, Octal-Chan, Ultra-Low Glitch, Voltage Output, 2-Wire Interface DACs 數(shù)據(jù)表 (Rev. B) | 2012年 8月 30日 | |||
| 應用手冊 | A Basic Guide to I2C | PDF | HTML | 2022年 11月 8日 | |||
| 應用手冊 | 所選封裝材料的熱學和電學性質(zhì) | 2008年 10月 16日 | ||||
| 應用手冊 | 高速數(shù)據(jù)轉(zhuǎn)換 | 英語版 | 2008年 10月 16日 |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點
- 封裝廠地點
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