ZHCS779C March 2012 – July 2025 UCC28070 , UCC28070A
PRODUCTION DATA
| THERMAL METRIC(1) | UCC28070 | UCC28070A UCC28070 | UNIT | |
|---|---|---|---|---|
| DW (Wide-SOIC) |
PW (TSSOP) |
|||
| 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 78.1 | 99.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 42.5 | 34.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46 | 50.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 17.5 | 1.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.5 | 50.3 | °C/W |