ZHCSHH3B January 2018 – July 2018 TS5MP645
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TS5MP645 | UNIT | |
|---|---|---|---|
| YFP | |||
| 36 | |||
| RθJA | Junction-to-ambient thermal resistance | 57.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 12.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 12.7 | °C/W |