ZHCSJN6F May 2019 – April 2025 TLV9001-Q1 , TLV9002-Q1 , TLV9004-Q1
PRODMIX
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6.8 典型特性
在 TA = 25°C、V+ = 2.75V、V– = –2.75V、RL = 10kΩ 連接到 VS/2、VCM = VS/2 且 VOUT = VS/2 條件下測得（除非另有說明）
| VS = 5V |
| CL = 10pF | ||
| CL = 10pF |
| VS = 5.5V | VCM = 2.5V | G = 1 |
| BW = 80kHz | VOUT = 0.5VRMS |
| G = -1 | VIN = 100mVpp | |
| G = 1 | VIN = 6.5VPP | |
| G = 1 | VIN = 100mVPP | CL = 10pF |
| G = 1 | CL = 100pF | 2V 階躍 |
| VS = 5V，TA = –40°C 至 +125°C |
| VS = 1.8V 至 5.5V |
| VCM = (V–) – 0.1V 至 (V+) – 1.4V | ||
| VS = 5.5V | VCM = 2.5V | f = 1kHz |
| G = 1 | BW = 80kHz |
| G = 1 | VIN = 100mVpp | |
圖 6-26 相位裕度與容性負載間的關(guān)系
| G = -10 | VIN = 600mVPP | |
| G = 1 | VIN = 4VPP | CL = 10pF |
| G = 1 | CL = 100pF | 2V 階躍 |
