ZHCSND8 april 2021 LM117QML-SP
PRODUCTION DATA
| THERMAL METRIC(1) | PACKAGE | UNIT | ||||
|---|---|---|---|---|---|---|
TO-3 (K) 2 pin (LM117K) | TO-39 (NDT) 3 pin (LM117H) | CFP SOIC (NAC) 16 pin (LM117GW) | ||||
| R θJA | Junction-to-ambient thermal resistance | Still air | 39 | 186 | 130 | °C/W |
| 500 LF/min air flow | 14 | 64 | 80 | |||
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | 1.9 | 21 | 7 | °C/W | |