ZHCSP68C December 2021 – October 2022 DRV8328
PRODUCTION DATA
| THERMAL METRIC(1) | DRV8329 | UNIT | |
|---|---|---|---|
| REE (WQFN) | |||
| 36 | |||
| RθJA | Junction-to-ambient thermal resistance | 37.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 25.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 15.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.5 | °C/W |