SFFSAN5 July 2025 UCC25661-Q1
This section provides functional safety failure in time (FIT) rates for the UCC25661x-Q1 based on two different industry-wide used reliability standards:
| FIT IEC TR 62380 / ISO 26262 | Power Dissipation (mW) | FIT (Failures Per 109 Hours) |
|---|---|---|
| Total component FIT rate | 100 | 18 |
| 200 | 19 | |
| 300 | 21 | |
| Die FIT rate | 100 | 3 |
| 200 | 4 | |
| 300 | 5 | |
| Package FIT rate | 100 | 15 |
| 200 | 15 | |
| 300 | 16 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
| Table | Category | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|
| 5 | CMOS,
BICMOS Digital, analog, or mixed | 60 FIT | 70°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.