SDYU001AC June 2015 – November 2025 LSF0101 , LSF0102 , LSF0108 , SN74GTL2014 , SN74HC245 , SN74LS07 , SN74LV123A , SN74LV1T08 , SN74LV1T34 , SN74LV244AT , SN74LV245A , SN74LV4T125 , SN74LVC14A , SN74LVC1G08 , SN74LVC1G125 , SN74LVC245A , SN74LVTH125 , SN74LVTH16244A , SN74LVTH16245A , SN74LVTH245A
TI continues to invest in the future of standard logic products with the latest VSSOP (DGS), SOT-23-THN (DYY), and X2QFN (DTX) packages.
VSSOP and SOT-23-THN packages provide 0.5mm pitch for maximum space savings while also maximizing manufacturability.
TI is not only investing in the standard logic space, but also in popular little logic functions. TI has released the newest and smallest next generation X2SON package (a.k.a. X2QFN) for 5-pin and 6-pin devices. The 5-pin DPW package is just 0.8 × 0.8 × 0.4 mm (0.5-mm pitch), whereas the 6-pin DTB package is only 0.8 × 1.0 × 0.4 mm (0.4-mm pitch)