ZHCSC42J July 2013 – October 2014 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD
PRODUCTION DATA.
- 1器件概述
- 2修訂歷史記錄
- 3Device Comparison
- 4Terminal Configuration and Functions
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5Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 Handling Ratings
- 5.3 Power-On Hours (POH)
- 5.4 Recommended Operating Conditions
- 5.5 External Digital Slow Clock Requirements
- 5.6 Thermal Characteristics
- 5.7 WLAN Performance
- 5.8 Bluetooth Performance
- 5.9 Bluetooth LE Performance
- 5.10 Bluetooth-BLE Dynamic Currents
- 5.11 Bluetooth LE Currents
- 5.12
Timing and Switching Characteristics
- 5.12.1 Power Management
- 5.12.2 Power-Up and Shut-Down States
- 5.12.3 Chip Top-level Power-Up Sequence
- 5.12.4 WLAN Power-Up Sequence
- 5.12.5 Bluetooth-BLE Power-Up Sequence
- 5.12.6 WLAN SDIO Transport Layer
- 5.12.7 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
- 5.12.8 Bluetooth Codec-PCM (Audio) Timing Specifications
- 6Detailed Description
- 7Applications and Implementation
- 8Device and Documentation Support
- 9Mechanical Packaging and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- MOC|100
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
8 Device and Documentation Support
8.1 Device Support
8.1.1 Development Support
For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
8.1.2 Device Support Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices.
| X | Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer: “This product is still in development and is intended for internal evaluation purposes.” Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device. | |
| null | Device is qualified and released to production. TI’s standard warranty applies to production devices. |
8.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
Table 8-1 Related Links
| PARTS | PRODUCT FOLDER | SAMPLE & BUY | TECHNICAL DOCUMENTS | TOOLS & SOFTWARE | SUPPORT & COMMUNITY |
|---|---|---|---|---|---|
| WL1801MOD | Click here | Click here | Click here | Click here | Click here |
| WL1805MOD | Click here | Click here | Click here | Click here | Click here |
| WL1831MOD | Click here | Click here | Click here | Click here | Click here |
| WL1835MOD | Click here | Click here | Click here | Click here | Click here |
8.3 社區(qū)資源
下列鏈接提供到 TI 社區(qū)資源的連接。 鏈接的內(nèi)容由各個分銷商“按照原樣”提供。 這些內(nèi)容并不構(gòu)成 TI 技術(shù)規(guī)范和標(biāo)準(zhǔn)且不一定反映 TI 的觀點；請見 TI 的使用條款。
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TI E2E™ 在線社區(qū) TI 工程師對工程師 (E2E) 社區(qū)。 此社區(qū)的創(chuàng)建目的是為了促進(jìn)工程師之間協(xié)作。 在 e2e.ti.com 中，您可以咨詢問題、共享知識、探索思路，在同領(lǐng)域工程師的幫助下解決問題。
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德州儀器 (TI) 嵌入式處理器維基網(wǎng)站 德州儀器 (TI) 嵌入式處理器維基網(wǎng)站。 此網(wǎng)站的建立是為了幫助開發(fā)人員從德州儀器 (TI) 的嵌入式處理器入門并且也為了促進(jìn)與這些器件相關(guān)的硬件和軟件的總體知識的創(chuàng)新和增長。
8.4 商標(biāo)
E2E is a trademark of Texas Instruments.
ARM is a registered trademark of ARM Physical IP, Inc.
Android is a trademark of Google Inc.
IEEE Std 802.11 is a trademark of IEEE.
Linux is a registered trademark of Linus Torvalds.
All other trademarks are the property of their respective owners.
8.5 靜電放電警告
ESD 可能會損壞該集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理措施和安裝程序 , 可能會損壞集成電路。
ESD 的損壞小至導(dǎo)致微小的性能降級 , 大至整個器件故障。 精密的集成電路可能更容易受到損壞 , 這是因為非常細(xì)微的參數(shù)更改都可能會導(dǎo)致器件與其發(fā)布的規(guī)格不相符。