ZHCSC42J July   2013  – October 2014 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA.  

1. 1器件概述
   1. 1.1 特性
   2. 1.2 應(yīng)用范圍
   3. 1.3 說明
   4. 1.4 功能方框圖
2. 2修訂歷史記錄
3. 3Device Comparison
4. 4Terminal Configuration and Functions
   1. 4.1 Pin Description
5. 5Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  Handling Ratings
   3. 5.3  Power-On Hours (POH)
   4. 5.4  Recommended Operating Conditions
   5. 5.5  External Digital Slow Clock Requirements
   6. 5.6  Thermal Characteristics
   7. 5.7  WLAN Performance
      1. 5.7.1 WLAN 2.4-GHz Receiver Characteristics
      2. 5.7.2 WLAN 2.4-GHz Transmitter Power
      3. 5.7.3 WLAN Currents
   8. 5.8  Bluetooth Performance
      1. 5.8.1 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
      2. 5.8.2 Bluetooth Transmitter, BR
      3. 5.8.3 Bluetooth Transmitter, EDR
      4. 5.8.4 Bluetooth Modulation, BR
      5. 5.8.5 Bluetooth Modulation, EDR
   9. 5.9  Bluetooth LE Performance
      1. 5.9.1 Bluetooth LE Receiver Characteristics - In-Band Signals
      2. 5.9.2 Bluetooth LE Transmitter Characteristics
      3. 5.9.3 Bluetooth LE Modulation Characteristics
   10. 5.10 Bluetooth-BLE Dynamic Currents
   11. 5.11 Bluetooth LE Currents
   12. 5.12 Timing and Switching Characteristics
       1. 5.12.1 Power Management
          1. 5.12.1.1 Block Diagram - Internal DC2DCs
       2. 5.12.2 Power-Up and Shut-Down States
       3. 5.12.3 Chip Top-level Power-Up Sequence
       4. 5.12.4 WLAN Power-Up Sequence
       5. 5.12.5 Bluetooth-BLE Power-Up Sequence
       6. 5.12.6 WLAN SDIO Transport Layer
          1. 5.12.6.1 SDIO Timing Specifications
          2. 5.12.6.2 SDIO Switching Characteristics - High Rate
       7. 5.12.7 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
          1. 5.12.7.1 UART 4-Wire Interface - H4
       8. 5.12.8 Bluetooth Codec-PCM (Audio) Timing Specifications
6. 6Detailed Description
   1. 6.1 WLAN
   2. 6.2 Bluetooth
   3. 6.3 BLE
   4. 6.4 WiLink 8 Module Markings
   5. 6.5 Test Grades
7. 7Applications and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1835MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
         1. 7.1.6.1 Baking Recommendations
         2. 7.1.6.2 SMT Recommendations
8. 8Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Support Nomenclature
   2. 8.2 Related Links
   3. 8.3 社區(qū)資源
   4. 8.4 商標(biāo)
   5. 8.5 靜電放電警告
   6. 8.6 術(shù)語表
9. 9Mechanical Packaging and Orderable Information
   1. 9.1 TI Module Mechanical Outline
   2. 9.2 Packaging Information