ZHCSMM7A April 2022 – May 2024 TUSB1004
PRODUCTION DATA
For this design example, use the parameters shown in Table 7-1.
| PARAMETER | VALUE | |
|---|---|---|
| 10 Gbps USB 3.2 pre-channel A to B PCB trace length, XAB. Refer to Figure 7-1. | 2 inches <= XAB <= 12 inches - MAX(XCD or XCE) | |
| 10 Gbps USB post-channel C to D PCB trace length, XCD and XCE. Refer to Figure 7-1. | up to 4 inches | |
| Minimum distance of the AC capacitors from TUSB1004, LAC-CAP | 0.4 inches | |
| Maximum distance of ESD component from the USB receptacle, LESD | 1.0 inches | |
| Maximum distance of series resistor (RESD) from ESD component, LR_ESD. | 0.25 inches | |
| CAC-USB1 AC-coupling capacitor (75 nF to 265 nF) | 220 nF | |
| CAC-USB2 AC-coupling capacitor (297 nF to 363 nF) | Options:
|
|
| Optional RRX resistor (220-kΩ ± 5%) | No used | |
| RESD (0-? to 2.2-?) | 1-? | |
| VCC supply (3-V to 3.6-V) | 3.3-V | |
| I2C Mode or Pin-strap Mode | Pin-strap mode (MODE = "0") | |
| 1.8-V or 3.3-V I2C Interface | 3.3-V I2C. VIO_SEL pin to Float "F". | |