ZHCSLP4C August 2007 – December 2024 TRSF3232E
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 ESD Protection, Driver
- 5.4 ESD Protection, Receiver
- 5.5 Recommended Operating Conditions
- 5.6 Thermal Information
- 5.7 Electrical Characteristics
- 5.8 Electrical Characteristics, Driver
- 5.9 Electrical Characteristics, Receiver
- 5.10 Switching Characteristics, Driver
- 5.11 Switching Characteristics, Reveiver
- 5.12 Typical Characteristics
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5.12 Typical Characteristics
Figure 5-1 Driver pulse skew at TA = 25°C (RGT
package)
Figure 5-3 Receiver path high-to-low propagation delay,
CL = 150pF
(RGT package)
Figure 5-2 Receiver path skew at TA = 25°C
(tpHL-tpLH) (RGT
package)
Figure 5-4 Receiver path low-to-high propagation delay,
CL = 150pF (RGT package)