10 Revision History
Changes from Revision B (July 2021) to Revision C (December 2024)
- 將器件信息 表更改為封裝信息 表Go
- 向數(shù)據(jù)表中添加了 SOT-23-THN (DYY) 封裝Go
- Added Note 2 to the ESD Ratings, IEC Specifications
Go
Changes from Revision A (December 2020) to Revision B (July 2021)
- 更改了應(yīng)用 列表Go
- Changed the table note for the ESD Ratings, IEC Specifications to make it applicable to all packagesGo
- Changed the thermal information for PW and DB packagesGo
Changes from Revision * (June 2007) to Revision A (December 2020)
- 添加了 ESD 等級(jí)、IEC 規(guī)格 表、熱性能信息 表、典型特性 部分、詳細(xì)描述 部分、應(yīng)用和實(shí)施 部分、電源相關(guān)建議 部分、布局 部分、器件和文檔支持 部分以及機(jī)械、封裝和可訂購(gòu)信息 部分Go
- 刪除了訂購(gòu)信息 表Go
- Added the RGT (VQFN-16) package pinout Go
- Added data rate and
tsk(p) rows for the RGT package in Driver Section
Switching Characteristics table Go
- Added tpLH, tpHL, tsk(p) rows for the RGT
package in Reciever Section Switching Characteristics table Go