ZHCSAI3F May 2012 – August 2024 TPS65131-Q1
PRODUCTION DATA
| THERMAL METRIC# | TPS65131-Q1 | UNIT | |
|---|---|---|---|
| RGE PACKAGE | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 34.1 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 36.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 12.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 12.3 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | 2.8 | °C/W |