ZHCSLD3B May 2020 – December 2023 TPS566231 , TPS566238
PRODUCTION DATA
| THERMAL METRIC(1) | TPS566231/8,TPS5662381P/8P | UNIT | |
|---|---|---|---|
| RQF(VQFN) | |||
| 9 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 89.6 | °C/W |
| RθJA_effective | Junction-to-ambient thermal resistance with TI EVM | 44 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 72.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 25 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 2.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 24.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |