ZHCSGO0A June 2017 – February 2024 TPS549B22
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TPS549B22 | UNIT | |
|---|---|---|---|
| RVF (LQFN-CLIP) | |||
| 40 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 28.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 3.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.96 | °C/W |
| ψJB | Junction-to-board characterization parameter | 3.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.6 | °C/W |