ZHCSHX1E March 2018 – August 2021 TMP1075
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 說明（續(xù)）
- 6 Device Comparison
- 7 Pin Configuration and Functions
-
8 Specifications
- 8.1 Absolute Maximum Ratings
- 8.2 ESD Ratings
- 8.3 Recommended Operating Conditions
- 8.4 Thermal Information
- 8.5 Electrical Characteristics:TMP1075
- 8.6 Electrical Characteristics: TMP1075N
- 8.7 Timing Requirements:TMP1075
- 8.8 Timing Requirements: TMP1075N
- 8.9 Switching Characteristics
- 8.10 Typical Characteristics
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 Digital Temperature Output
- 9.3.2
I2C and SMBus Serial Interface
- 9.3.2.1 Bus Overview
- 9.3.2.2 Serial Bus Address
- 9.3.2.3 Pointer Register
- 9.3.2.4 Writing and Reading to the TMP1075
- 9.3.2.5 Operation Mode
- 9.3.2.6 SMBus Alert Function
- 9.3.2.7 General Call- Reset Function
- 9.3.2.8 High-Speed Mode (HS)
- 9.3.2.9 Coexists in I3C Mixed Fast Mode
- 9.3.2.10 Time-Out Function
- 9.3.3 Timing Diagrams
- 9.3.4 Two-Wire Timing Diagrams
- 9.4 Device Functional Modes
- 9.5
Register Map
- 9.5.1
Register Descriptions
- 9.5.1.1 Temperature Register (address = 00h) [default reset = 0000h]
- 9.5.1.2 Configuration Register (address = 01h) [default reset = 00FFh (60A0h TMP1075N)]
- 9.5.1.3 Low Limit Register (address = 02h) [default reset = 4B00h]
- 9.5.1.4 High Limit Register (address = 03h) [default reset = 5000h]
- 9.5.1.5 Device ID Register (address = 0Fh) [default reset = 7500]
- 9.5.1
Register Descriptions
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
訂購信息
8.10 Typical Characteristics
at TA = 25°C, V+ = 3.3 V, and apply to D, DGK, and DSG packages (unless otherwise noted)
Figure 8-1 DGK & D Temperature Error vs. Temperature
Figure 8-3 TMP1075NDRL Temperature Error vs. Temperature
Figure 8-5 Average Current vs. Conversion Rates and Temperature
Figure 8-7 Supply Current vs. I2C Bus Clock and Supply Voltage in Shutdown Mode
Figure 8-9 Sampling Period Change vs. Temperature (1.7 V to 5.5 V)
Figure 8-2 DSG Temperature Error vs. Temperature
Figure 8-4 Shutdown Current vs. Temperature
Figure 8-6 Supply Current vs. Input Cell Voltage
Figure 8-8 ALERT Pin Output Voltage vs. Sink Current