ZHCS844D November 2011 – January 2025 TLV70012-Q1 , TLV70018-Q1
PRODUCTION DATA
The ability to remove heat from the die is different for each package type, presenting different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air.
Thermal performance data for TLV70018-Q1 and TLV70012-Q1 were gathered using the TLV700 evaluation module (EVM), a 2-layer board with two ounces of copper per side. Corresponding thermal performance data are given in Thermal Information. Note that this board has provision for soldering not only the SOT23-5 package on the bottom layer, but also the SC-70 package on the top layer. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves heatsink effectiveness.