ZHCSHO9Q July 2006 – August 2024 TLK2711-SP
PRODUCTION DATA
| THERMAL METRIC(1) | TLK2711-SP | UNIT | |
|---|---|---|---|
| HFG (CFP) | |||
| 68 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 36.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 21.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 23.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 14.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 23.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.4 | °C/W |