ZHCSHO9Q July 2006 – August 2024 TLK2711-SP
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information
- 5.5 TTL Input Electrical Characteristics
- 5.6 Transmitter/Receiver Electrical Characteristics
- 5.7 Reference Clock (TXCLK) Timing Requirements
- 5.8 TTL Output Switching Characteristics
- 5.9 Typical Characteristics
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3
Feature Description
- 6.3.1 Transmit Interface
- 6.3.2 Transmit Data Bus
- 6.3.3 Data Transmission Latency
- 6.3.4 8-Bit/10-Bit Encoder
- 6.3.5 Pseudo-Random Bit Stream (PRBS) Generator
- 6.3.6 Parallel to Serial
- 6.3.7 High-Speed Data Output
- 6.3.8 Receive Interface
- 6.3.9 Receive Data Bus
- 6.3.10 Data Reception Latency
- 6.3.11 Serial to Parallel
- 6.3.12 Comma Detect and 8-Bit/10-Bit Decoding
- 6.3.13 LOS Detection
- 6.3.14 PRBS Verification
- 6.3.15 Reference Clock Input
- 6.3.16 Operating Frequency Range
- 6.3.17 Testability
- 6.3.18 Loopback Testing
- 6.3.19 BIST
- 6.3.20 Power-On Reset
- 6.4 Device Functional Modes
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- HFG|68
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
8.4 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |