ZHCSHX6C August 2017 – February 2023 THS3491
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Bare Die Information
- 8 Specifications
- 9 Detailed Description
- 10Application and Implementation
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
8.7 Typical Characteristics: ±15 V
at +VS = 15 V, –VS = –15 V, TA ? 25°C, RLOAD = 100 Ω to midsupply, noninverting gain (G) = 5 V/V. RGT package : RF = 576 Ω, RG = 143 Ω, or DDA package: RF = 798 Ω, RG = 200 Ω (unless otherwise noted)
| VO = 2 VPP | RGT package | |
| VO = 2 VPP |
| DDA package |
| VO = 2 VPP | RGT package |
| VO = 2 VPP |
| VO = 2 VPP | RLoad = 1 kΩ | |
| ±100-kHz frequency spacing |
| VO = 10 VPP |
| VO = 10 VPP |
| VIN = 2 VPP |
A. Measured with devices soldered on TI EVM. Devices not turned off at any read points but load applied for a few milliseconds to measure VOUT and then removed.
Figure 8-31 Output Voltage Swing vs Output Current
| 7100 units at each supply |
| Flash tested to keep TJ as close to TA as possible |
| Flash tested to keep TJ as close to TA as possible |
| 90 units at each supply |
| Device in shutdown mode to minimize self-heating, RGT package |
| VO = 2 VPP | DDA package | |
| RGT package; see Section 9.4.4 section for more details |
| VO = 2 VPP | RGT package | |
| DDA package |
| VO = 2 VPP | RGT package |
| VO = 2 VPP |
| VO = 5 VPP per tone | ±100-kHz frequency spacing |
| ±100-kHz frequency spacing |
| No load |
| VO = 20 VPP |
| VO = 20 VPP |
| 7100 units at each supply |
| 7100 units at each supply |
| Flash tested to keep TJ as close to TA as possible |
| 90 units at each supply |
| 90 units at each supply |