ZHCSHX6C August 2017 – February 2023 THS3491
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Bare Die Information
- 8 Specifications
- 9 Detailed Description
- 10Application and Implementation
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
7 Bare Die Information
| DIE THICKNESS | BACKSIDE FINISH | BACKSIDE POTENTIAL | BOND PAD METALLIZATION | BOND PAD DIMENSIONS |
|---|---|---|---|---|
| 15 mils (381 μm) | Silicon with backgrind | Wafer backside is electrically connected to -VS | Al | 76.0 μm × 76.0 μm |
Bond Pad Coordinates in Microns
| NAME | PAD NUMBER | X MIN | Y MIN | X MAX | Y MAX |
|---|---|---|---|---|---|
| FB | 1 | 26.9 | 887 | 103 | 963 |
| VIN- | 2 | 26.9 | 549 | 103 | 625 |
| VIN+ | 3 | 26.9 | 211 | 103 | 287 |
| REF | 4 | 180 | 23.7 | 256 | 99.7 |
| DNC | 5 | 431 | 23.7 | 507 | 99.7 |
| TJ_SENSE | 6 | 601 | 23.7 | 677 | 99.7 |
| -VS | 7 | 760 | 23.7 | 836 | 99.7 |
| -VS | 8 | 862 | 23.7 | 938 | 99.7 |
| -VS | 9 | 993 | 23.7 | 1069 | 99.7 |
| -VS | 10 | 1222 | 292 | 1298 | 368 |
| VOUT | 11 | 1222 | 459 | 1298 | 535 |
| VOUT | 12 | 1222 | 639 | 1298 | 715 |
| +VS | 13 | 1222 | 806 | 1298 | 882 |
| +VS | 14 | 993 | 1074 | 1069 | 1150 |
| +VS | 15 | 862 | 1074 | 938 | 1150 |
| +VS | 16 | 760 | 1074 | 836 | 1150 |
| DNC | 17 | 601 | 1074 | 677 | 1150 |
| PD | 18 | 431 | 1074 | 507 | 1150 |
| REF | 19 | 180 | 1074 | 256 | 1150 |