ZHCSN53B December 2019 – March 2021 SN74LXCH8T245
PRODUCTION DATA
| THERMAL METRIC(1) | SN74LXC8T245 | UNIT | ||
|---|---|---|---|---|
| PW (TSSOP) | RHL (VQFN) | |||
| 24 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 98.2 | 45.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 42.3 | 41.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 53.3 | 23.3 | °C/W |
| YJT | Junction-to-top characterization parameter | 5.8 | 2.2 | °C/W |
| YJB | Junction-to-board characterization parameter | 52.9 | 23.3 | °C/W |
| RθJC(bottom) | Junction-to-case (bottom) thermal resistance | N/A | 13.2 | °C/W |