ZHCSIO3I January 2005 – August 2024 PCF8575
PRODUCTION DATA
| THERMAL METRIC (1) | PCF8575 | UNIT | |||||||
|---|---|---|---|---|---|---|---|---|---|
| DB | DBQ | DGV | DW | PW | RGE | ||||
| 24 PINS | |||||||||
| RθJA | Junction-to-ambient thermal resistance | 87.8 | 61 | 86 | 75.6 | 99.7 | 53.6 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 51.9 | 47.9 | 42.5 | 50.8 | °C/W | |||
| RθJB | Junction-to-board thermal resistance | 56.8 | 50.1 | 66.1 | 31.5 | °C/W | |||
| ΨJT | Junction-to-top characterization parameter | 14.3 | 21.1 | 2.7 | 3.4 | °C/W | |||
| ΨJB | Junction-to-board characterization parameter | 56.2 | 49.7 | 65.5 | 31.4 | °C/W | |||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | 14.8 | °C/W | |||