ZHCSH74B december   2017  – august 2023 LMK61E07

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說(shuō)明
5. 4 Revision History
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics - Power Supply
   6. 6.6  LVPECL Output Characteristics
   7. 6.7  LVDS Output Characteristics
   8. 6.8  HCSL Output Characteristics
   9. 6.9  Frequency Tolerance Characteristics
   10. 6.10 Frequency Margining Characteristics
   11. 6.11 Power-On Reset Characteristics (VDD)
   12. 6.12 I2C-Compatible Interface Characteristics (SDA, SCL)
   13. 6.13 PSRR Characteristics
   14. 6.14 Other Characteristics
   15. 6.15 PLL Clock Output Jitter Characteristics
   16. 6.16 Typical 156.25-MHz Output Phase Noise Characteristics
   17. 6.17 Typical 161.1328125 MHz Output Phase Noise Characteristics
   18. 6.18 Additional Reliability and Qualification
   19. 6.19 Typical Characteristics
8. 7 Parameter Measurement Information
   1. 7.1 Device Output Configurations
9. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  Device Block-Level Description
      2. 8.3.2  Device Configuration Control
      3. 8.3.3  Register File Reference Convention
      4. 8.3.4  Configuring the PLL
      5. 8.3.5  Integrated Oscillator
      6. 8.3.6  Reference Divider and Doubler
      7. 8.3.7  Phase Frequency Detector
      8. 8.3.8  Feedback Divider (N)
      9. 8.3.9  Fractional Engine
      10. 8.3.10 Charge Pump
      11. 8.3.11 Loop Filter
      12. 8.3.12 VCO Calibration
      13. 8.3.13 High-Speed Output Divider
      14. 8.3.14 High-Speed Clock Output
      15. 8.3.15 Device Status
          1. 8.3.15.1 Loss of Lock
   4. 8.4 Device Functional Modes
      1. 8.4.1 Interface and Control
      2. 8.4.2 DCXO Mode and Frequency Margining
         1. 8.4.2.1 DCXO Mode
         2. 8.4.2.2 Fine Frequency Margining
         3. 8.4.2.3 Coarse Frequency Margining
   5. 8.5 Programming
      1. 8.5.1 I2C Serial Interface
      2. 8.5.2 Block Register Write
      3. 8.5.3 Block Register Read
      4. 8.5.4 Write SRAM
      5. 8.5.5 Write EEPROM
      6. 8.5.6 Read SRAM
      7. 8.5.7 Read EEPROM
   6. 8.6 Register Maps
      1. 8.6.1 Register Descriptions
         1. 8.6.1.1  VNDRID_BY1 Register; R0
         2. 8.6.1.2  VNDRID_BY0 Register; R1
         3. 8.6.1.3  PRODID Register; R2
         4. 8.6.1.4  REVID Register; R3
         5. 8.6.1.5  TARGETADR Register; R8
         6. 8.6.1.6  EEREV Register; R9
         7. 8.6.1.7  DEV_CTL Register; R10
         8. 8.6.1.8  XO_CAPCTRL_BY1 Register; R16
         9. 8.6.1.9  XO_CAPCTRL_BY0 Register; R17
         10. 8.6.1.10 DIFFCTL Register; R21
         11. 8.6.1.11 OUTDIV_BY1 Register; R22
         12. 8.6.1.12 OUTDIV_BY0 Register; R23
         13. 8.6.1.13 RDIVCMOSCTL Register; R24
         14. 8.6.1.14 PLL_NDIV_BY1 Register; R25
         15. 8.6.1.15 PLL_NDIV_BY0 Register; R26
         16. 8.6.1.16 PLL_FRACNUM_BY2 Register; R27
         17. 8.6.1.17 PLL_FRACNUM_BY1 Register; R28
         18. 8.6.1.18 PLL_FRACNUM_BY0 Register; R29
         19. 8.6.1.19 PLL_FRACDEN_BY2 Register; R30
         20. 8.6.1.20 PLL_FRACDEN_BY1 Register; R31
         21. 8.6.1.21 PLL_FRACDEN_BY0 Register; R32
         22. 8.6.1.22 PLL_MASHCTRL Register; R33
         23. 8.6.1.23 PLL_CTRL0 Register; R34
         24. 8.6.1.24 PLL_CTRL1 Register; R35
         25. 8.6.1.25 PLL_LF_R2 Register; R36
         26. 8.6.1.26 PLL_LF_C1 Register; R37
         27. 8.6.1.27 PLL_LF_R3 Register; R38
         28. 8.6.1.28 PLL_LF_C3 Register; R39
         29. 8.6.1.29 PLL_CALCTRL Register; R42
         30. 8.6.1.30 NVMSCRC Register; R47
         31. 8.6.1.31 NVMCNT Register; R48
         32. 8.6.1.32 NVMCTL Register; R49
         33. 8.6.1.33 NVMLCRC Register; R50
         34. 8.6.1.34 MEMADR Register; R51
         35. 8.6.1.35 NVMDAT Register; R52
         36. 8.6.1.36 RAMDAT Register; R53
         37. 8.6.1.37 NVMUNLK Register; R56
         38. 8.6.1.38 INT_LIVE Register; R66
         39. 8.6.1.39 SWRST Register; R72
10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
       1. 9.2.1 Design Requirements
       2. 9.2.2 Detailed Design Procedure
          1. 9.2.2.1 PLL Loop Filter Design
          2. 9.2.2.2 Spur Mitigation Techniques
             1. 9.2.2.2.1 Phase Detection Spur
             2. 9.2.2.2.2 Integer Boundary Fractional Spur
             3. 9.2.2.2.3 Primary Fractional Spur
             4. 9.2.2.2.4 Sub-Fractional Spur
          3. 9.2.2.3 Device Programming
       3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
       1. 9.4.1 Layout Guidelines
          1. 9.4.1.1 Ensured Thermal Reliability
          2. 9.4.1.2 Best Practices for Signal Integrity
          3. 9.4.1.3 Recommended Solder Reflow Profile
       2. 9.4.2 Layout Example
11. 10Device and Documentation Support
    1. 10.1 Documentation Support
       1. 10.1.1 Related Documentation
    2. 10.2 接收文檔更新通知
    3. 10.3 支持資源
    4. 10.4 Trademarks
    5. 10.5 靜電放電警告
    6. 10.6 術(shù)語(yǔ)表
12. 11Mechanical, Packaging, and Orderable Information