ZHCSH74B december 2017 – august 2023 LMK61E07
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMK61E07(2) (3) (4) | UNIT | |||
|---|---|---|---|---|---|
| SIA (QFM) | |||||
| 8 PINS | |||||
| Airflow (LFM) 0 | Airflow (LFM) 200 | Airflow (LFM) 400 | |||
| RθJA | Junction-to-ambient thermal resistance | 54 | 44 | 41.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 34 | n/a | n/a | °C/W |
| RθJB | Junction-to-board thermal resistance | 36.7 | n/a | n/a | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.2 | 16.9 | 21.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 36.7 | 37.8 | 38.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |