ZHCSH74B december 2017 – august 2023 LMK61E07
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics - Power Supply
- 6.6 LVPECL Output Characteristics
- 6.7 LVDS Output Characteristics
- 6.8 HCSL Output Characteristics
- 6.9 Frequency Tolerance Characteristics
- 6.10 Frequency Margining Characteristics
- 6.11 Power-On Reset Characteristics (VDD)
- 6.12 I2C-Compatible Interface Characteristics (SDA, SCL)
- 6.13 PSRR Characteristics
- 6.14 Other Characteristics
- 6.15 PLL Clock Output Jitter Characteristics
- 6.16 Typical 156.25-MHz Output Phase Noise Characteristics
- 6.17 Typical 161.1328125 MHz Output Phase Noise Characteristics
- 6.18 Additional Reliability and Qualification
- 6.19 Typical Characteristics
- 7 Parameter Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Device Block-Level Description
- 8.3.2 Device Configuration Control
- 8.3.3 Register File Reference Convention
- 8.3.4 Configuring the PLL
- 8.3.5 Integrated Oscillator
- 8.3.6 Reference Divider and Doubler
- 8.3.7 Phase Frequency Detector
- 8.3.8 Feedback Divider (N)
- 8.3.9 Fractional Engine
- 8.3.10 Charge Pump
- 8.3.11 Loop Filter
- 8.3.12 VCO Calibration
- 8.3.13 High-Speed Output Divider
- 8.3.14 High-Speed Clock Output
- 8.3.15 Device Status
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1
Register Descriptions
- 8.6.1.1 VNDRID_BY1 Register; R0
- 8.6.1.2 VNDRID_BY0 Register; R1
- 8.6.1.3 PRODID Register; R2
- 8.6.1.4 REVID Register; R3
- 8.6.1.5 TARGETADR Register; R8
- 8.6.1.6 EEREV Register; R9
- 8.6.1.7 DEV_CTL Register; R10
- 8.6.1.8 XO_CAPCTRL_BY1 Register; R16
- 8.6.1.9 XO_CAPCTRL_BY0 Register; R17
- 8.6.1.10 DIFFCTL Register; R21
- 8.6.1.11 OUTDIV_BY1 Register; R22
- 8.6.1.12 OUTDIV_BY0 Register; R23
- 8.6.1.13 RDIVCMOSCTL Register; R24
- 8.6.1.14 PLL_NDIV_BY1 Register; R25
- 8.6.1.15 PLL_NDIV_BY0 Register; R26
- 8.6.1.16 PLL_FRACNUM_BY2 Register; R27
- 8.6.1.17 PLL_FRACNUM_BY1 Register; R28
- 8.6.1.18 PLL_FRACNUM_BY0 Register; R29
- 8.6.1.19 PLL_FRACDEN_BY2 Register; R30
- 8.6.1.20 PLL_FRACDEN_BY1 Register; R31
- 8.6.1.21 PLL_FRACDEN_BY0 Register; R32
- 8.6.1.22 PLL_MASHCTRL Register; R33
- 8.6.1.23 PLL_CTRL0 Register; R34
- 8.6.1.24 PLL_CTRL1 Register; R35
- 8.6.1.25 PLL_LF_R2 Register; R36
- 8.6.1.26 PLL_LF_C1 Register; R37
- 8.6.1.27 PLL_LF_R3 Register; R38
- 8.6.1.28 PLL_LF_C3 Register; R39
- 8.6.1.29 PLL_CALCTRL Register; R42
- 8.6.1.30 NVMSCRC Register; R47
- 8.6.1.31 NVMCNT Register; R48
- 8.6.1.32 NVMCTL Register; R49
- 8.6.1.33 NVMLCRC Register; R50
- 8.6.1.34 MEMADR Register; R51
- 8.6.1.35 NVMDAT Register; R52
- 8.6.1.36 RAMDAT Register; R53
- 8.6.1.37 NVMUNLK Register; R56
- 8.6.1.38 INT_LIVE Register; R66
- 8.6.1.39 SWRST Register; R72
- 8.6.1
Register Descriptions
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- SIA|6
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
3 說明
LMK61E07 系列超低抖動(dòng) PLLatinum? 可編程振蕩器使用分?jǐn)?shù) N 頻率合成器與集成 VCO 來生成常用的參考時(shí)鐘。LMK61E07 的輸出可配置為 LVPECL、LVDS 或 HCSL。該器件可從片上 EEPROM 自啟動(dòng)，以便生成出廠編程的默認(rèn)輸出頻率，或者可通過 I2C 串行接口在系統(tǒng)中對(duì)器件寄存器和 EEPROM 設(shè)置進(jìn)行完全編程。該器件通過 I2C 串行接口提供精細(xì)和粗糙的頻率裕量控制，因此是一種數(shù)控振蕩器 (DCXO)。
您可以更新 PLL 反饋分頻器，從而使用 12.5MHz 的 PFD（R 分頻器=4，禁用倍頻器）以小于 1ppb 的步進(jìn)值進(jìn)行無峰值或毛刺的輸出頻率調(diào)節(jié)以符合 xDSL 要求，或使用 100MHz 的 PFD（R 分頻器=1，啟用倍頻器）以小于 5.2ppb 的步進(jìn)值進(jìn)行此調(diào)節(jié)以符合廣播視頻要求。頻率裕量特性還有利于進(jìn)行系統(tǒng)設(shè)計(jì)驗(yàn)證測試 (DVT)，如標(biāo)準(zhǔn)合規(guī)性和系統(tǒng)時(shí)序裕量測試。
(1) 如需了解所有可用封裝，請(qǐng)參閱數(shù)據(jù)表末尾的可訂購產(chǎn)品附錄。
(2) 封裝尺寸（長 × 寬）為標(biāo)稱值，并包括引腳（如適用）。
引腳分布和簡化框圖