ZHCSHO1D November   2018  – January 2019 LMG1210

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
   1.     Device Images
      1.      簡(jiǎn)化的典型應(yīng)用
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Switching Characteristics
   7. 6.7 Typical Characteristics
   8. 6.8 Timing Diagrams
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Bootstrap Diode Operation
      2. 7.3.2 LDO Operation
      3. 7.3.3 Dead Time Selection
      4. 7.3.4 Overtemperature Protection
      5. 7.3.5 High-Performance Level Shifter
      6. 7.3.6 Negative HS Voltage Handling
   4. 7.4 Device Functional Modes
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Bypass Capacitor
         2. 8.2.2.2 Bootstrap Diode Selection
         3. 8.2.2.3 Handling Ground Bounce
         4. 8.2.2.4 Independent Input Mode
         5. 8.2.2.5 Computing Power Dissipation
      3. 8.2.3 Application Curves
   3. 8.3 Do's and Don'ts
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 文檔支持
       1. 11.1.1 相關(guān)文檔
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標(biāo)
    5. 11.5 靜電放電警告
    6. 11.6 術(shù)語(yǔ)表
12. 12機(jī)械、封裝和可訂購(gòu)信息