ZHCSHO1D November 2018 – January 2019 LMG1210
PRODUCTION DATA.
| THERMAL METRIC(1) | LMG1210 | UNIT | |
|---|---|---|---|
| RVR (QFN) | |||
| 19 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 40.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 40 | °C/W |
| RθJB | Junction-to-board thermal resistance | 16.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 16.4 | °C/W |