ZHCSG61B march 2017 – april 2023 LMG1205
PRODUCTION DATA
| THERMAL METRIC(1) | LMG1205 | UNIT | ||
|---|---|---|---|---|
| YFX (DSBGA) | ||||
| 12 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 76.8 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.6 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 12.0 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 1.6 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 12.0 | °C/W | |