性插图动态图无遮挡,51亚洲宅男天堂在线观看

SNOS738I April 1995 – January 2017 LM9061 , LM9061-Q1

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

D|8
- MSOI002K

散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購(gòu)信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽¹⁾

	MIN	MAX	UNIT
Supply voltage		60	V
Output voltage		V_CC + 15	V
Voltage at sense and threshold (through 1 kΩ)	−25	60	V
ON/OFF input voltage	−0.3	V_CC + 0.3	V
Reverse supply current		20	mA
Junction temperature		150	°C
Lead temperature soldering, 10 seconds		260	°C
Storage temperature, T_stg	−55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings: LM9061

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM9061-Q1

				VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per AEC Q100-002⁽¹⁾		±2000	V
		Charged-device model (CDM), per AEC Q100-011	All pins except 1, 4, 5, and 8	±1000
		Charged-device model (CDM), per AEC Q100-011	Pins 1, 4, 5, and 8	±1000

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

	MIN	MAX	UNIT
Supply voltage	7	26	V
ON/OFF input voltage	−0.3	V_CC	V
Ambient temperature: LM9061	−40	125	°C
Junction temperature: LM9061-Q1	−40	125	°C

(1) Operating Ratings indicate conditions for which the device is intended to be functional, but may not meet the ensured specific performance limits. For ensured specifications and test conditions see the Typical Characteristics.

6.5 Thermal Information

THERMAL METRIC⁽¹⁾		LM9061, LM9061-Q1	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	150	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	46.7	°C/W
R_θJB	Junction-to-board thermal resistance	49.1	°C/W
ψ_JT	Junction-to-top characterization parameter	6.2	°C/W
ψ_JB	Junction-to-board characterization parameter	48.4	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

6.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
7 V ≤ V_CC ≤ 20 V, R_REF = 15.4 kΩ, −40°C ≤ T_J ≤ +125°C, unless otherwise specified.

PARAMETER		TEST CONDITIONS	MIN	MAX	UNIT
POWER SUPPLY
I_Q	Quiescent supply current	ON/OFF = 0		5	mA
I_CC	Operating supply current	ON/OFF = 1, C_LOAD = 0.025 µF, includes turnon transient output current		40	mA
ON/OFF CONTROL INPUT
V_IN(0)	ON/OFF input logic 0	V_OUT = OFF		1.5	V
V_IN(1)	ON/OFF input logic 1	V_OUT = ON	3.5		V
V_HYST	ON/OFF input hysteresis	Peak-to-peak	0.8	2	V
I_IN	ON/OFF input pulldown current	VON/OFF = 5 V	50	250	µA
GATE DRIVE OUTPUT
V_OH	Charge pump output voltage	ON/OFF = 1	V_CC + 7	V_CC + 15	V
V_OL	OFF output voltage	ON/OFF = 0, I_SINK = 110 µA		0.9	V
V_CLAMP	Sense to output clamp voltage	ON/OFF = 1, V_SENSE = V_THRESHOLD	11	15	V
I_{SINK(Normal-OFF)}	Output sink current normal operation	ON/OFF = 0, V_DELAY = 0 V, V_SENSE = V_THRESHOLD	75	145	µA
I_{SINK(Latch-OFF)}	Output sink current with protection comparator tripped	V_DELAY = 7 V, V_SENSE < V_THRESHOLD	5	15	µA
PROTECTION CIRCUITRY
V_REF	Reference voltage		1.15	1.35	V
I_REF	Threshold pin reference current	V_SENSE = V_THRESHOLD	75	88	µA
I_THR(LEAKAGE)	Threshold pin leakage current	V_CC = Open, 7 V ≤ V_THRESHOLD ≤ 20 V		10	µA
I_SENSE	Sense pin input bias current	V_SENSE = V_THRESHOLD		10	µA
DELAY TIMER
V_TIMER	Delay timer threshold voltage		5	6.2	V
V_SAT	Discharge transistor saturation voltage	I_DIS = 1 mA		0.4	V
I_DIS	Delay capacitor discharge current	V_DELAY = 5 V	2	10	mA
I_DELAY	Delay pin source current		6.74	15.44	µA

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
7V ≤ V_CC ≤ 20V, R_REF = 15.4 kΩ, −40°C ≤ T_J ≤ +125°C, C_LOAD = 0.025 µF, C_DELAY = 0.022 µF, unless otherwise specified.

PARAMETER		TEST CONDITIONS		MIN	MAX	UNIT
T_ON	Output turnon time	C_LOAD = 0.025 µF	7V ≤ V_CC ≤ 10 V, V_OUT ≥ V_CC + 7 V		1.5	ms
T_ON	Output turnon time	C_LOAD = 0.025 µF	10V ≤ V_CC ≤ 20 V, V_OUT ≥ V_CC + 11 V		1.5	ms
T_OFF(NORMAL)	Output turnoff time, normal operation⁽²⁾	C_LOAD = 0.025 µF V_CC = 14 V, V_OUT ≥ 25 V V_SENSE = V_THRESHOLD		4	10	ms
T_{OFF(Latch-OFF)}	Output turnoff time, protection comparator tripped⁽²⁾	C_LOAD = 0.025 µF V_CC = 14 V, V_OUT ≥ 25 V V_SENSE = V_THRESHOLD		45	140	ms
T_DELAY	Delay timer interval	C_DELAY = 0.022 µF		8	18	ms

(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

(2) The AC Timing specifications for T_OFF are not production tested, and therefore are not specifically ensured. Limits are provided for reference purposes only. Smaller load capacitances will have proportionally faster turn-ON and turn-OFF times.