SNVSB95 July 2019 LM3421-Q1 , LM3423-Q1
PRODUCTION DATA.
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIN, EN, RPD, nDIM | –0.3 | 76 | V | |
| –1 continuous | mA | |||
| OVP, HSP, HSN, LRDY, FLT, DPOL | –0.3 | 76 | V | |
| –100 continuous | µA | |||
| RCT | –0.3 | 76 | V | |
| –1 continuous | 5 continuous | mA | ||
| IS | –0.3 | 76 | V | |
| –2 for 100 ns | ||||
| –1 continuous | mA | |||
| VCC | –0.3 | 8 | V | |
| TIMR | –0.3 | 7 | V | |
| –100 continuous | 100 continuous | µA | ||
| COMP, CSH | –0.3 | 6 | V | |
| –200 continuous | 200 continuous | µA | ||
| GATE, DDRV | –0.3 | VCC | V | |
| –2.5 for 100 ns | VCC+ 2.5 for 100 ns | |||
| –1 continuous | 1 continuous | mA | ||
| PGND | –0.3 | 0.3 | V | |
| –2.5 for 100 ns | 2.5 for 100 ns | |||
| Continuous power dissipation | Internally Limited | |||
| Maximum junction temperature | Internally Limited | |||
| Maximum lead temperature (solder and reflow) (2) | 260 | °C | ||
| Storage temperature | –65 | 150 | °C | |