ZHCSXD2E July 2008 – February 2025 ISO721-Q1 , ISO722-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UNIT | ||||
|---|---|---|---|---|---|
| D (SOIC) | |||||
| 8 PINS | |||||
| RθJA | Junction-to-ambient thermal resistance | Low-K Thermal Resistance(2) | 212 | °C/W | |
| High-K Thermal Resistance | 122 | ||||
| RθJC(top) | Junction-to-case (top) thermal resistance | 69.1 | °C/W | ||
| RθJB | Junction-to-board thermal resistance | 47.7 | °C/W | ||
| ψJT | Junction-to-top characterization parameter | 15.2 | °C/W | ||
| ψJB | Junction-to-board characterization parameter | 47.2 | °C/W | ||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W | ||