ZHCSMP3A December 2019 – June 2021 ISO6731-Q1
PRODUCTION DATA
Figure 5-1 ISO6731-Q1 DW Package16-Pin SOIC-WBTop View| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | ISO6731-Q1 | ||
| EN1 | 7 | I | Output enable 1. Output pins on side 1 are enabled when EN1 is high or open and in high-impedance state when EN1 is low. |
| EN2 | 10 | I | Output enable 2. Output pins on side 2 are enabled when EN2 is high or open and in high-impedance state when EN2 is low. |
| GND1 | 2, 8 | — | Ground connection for VCC1 |
| GND2 | 9,15 | — | Ground connection for VCC2 |
| INA | 3 | I | Input, channel A |
| INB | 4 | I | Input, channel B |
| INC | 12 | I | Input, channel C |
| NC | 6,11 | Not connected | |
| OUTA | 14 | O | Output, channel A |
| OUTB | 13 | O | Output, channel B |
| OUTC | 5 | O | Output, channel C |
| VCC1 | 1 | — | Power supply, side 1 |
| VCC2 | 16 | — | Power supply, side 2 |