ZHCSRF0 December 2022 DS90LVRA2
PRODUCTION DATA
Bypass capacitors must be used on power pins. TI recommends using high-frequency, ceramic, 0.1-μF and 0.01-μF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the device supply pin. Additional scattered capacitors over the printed-circuit board improves decoupling. Multiple vias must be used to connect the decoupling capacitors to the power planes. A 10-μF bulk capacitor, 35-V (or greater) solid tantalum capacitor must be connected at the power entry point on the printed-circuit board between the supply and ground.