ZHCSGI4B August 2017 – February 2022 CSD22205L
PRODUCTION DATA
- 1特性
- 2應(yīng)用
- 3說明
- 4Revision History
- 5Specifications
- 6Device and Documentation Support
- 7Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- YMG|4
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5.2 Thermal Information
TA = 25°C (unless otherwise stated)
| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance(2) | 75 | °C/W | ||
| Junction-to-ambient thermal resistance(1) | 225 | ||||
(1) Device mounted on FR4 material with minimum Cu mounting
area.
(2) Device mounted on FR4 material with 1-in2
(6.45-cm2), 2-oz (0.071-mm) thick Cu.
|
Typ RθJA =75°C/W when mounted on 1 in2 of 2-oz Cu. |
|
Typ RθJA = 225°C/W when mounted on minimum pad area of 2-oz Cu. |