ZHCSAF2D October 2012 – September 2015 CSD17313Q2Q1
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Thermal resistance junction-to-case(1) | 7.4 | °C/W | ||
| RθJA | Thermal resistance junction-to-ambient(1)(2) | 67 | °C/W | ||
|
Max RθJA = 67°C/W when mounted on 1 inch2 (6.45 cm2) of 2 oz. (0.071 mm thick) Cu. |
|
Max RθJA = 228°C/W when mounted on a minimum pad area of 2 oz. (0.071 mm thick) Cu. |