ZHCSAF2D October 2012 – September 2015 CSD17313Q2Q1
PRODUCTION DATA.
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DQK|6
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5.2 Thermal Information
TA = 25°C (unless otherwise noted)| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Thermal resistance junction-to-case(1) | 7.4 | °C/W | ||
| RθJA | Thermal resistance junction-to-ambient(1)(2) | 67 | °C/W | ||
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071=mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
|
Max RθJA = 67°C/W when mounted on 1 inch2 (6.45 cm2) of 2 oz. (0.071 mm thick) Cu. |
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Max RθJA = 228°C/W when mounted on a minimum pad area of 2 oz. (0.071 mm thick) Cu. |