ZHCSGV7F July 2017 – January 2024 CDCI6214
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | RGE (VQFN) | UNIT | |
|---|---|---|---|
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 39.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 29.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 16.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 16.8 | °C/W |