ZHCSPR7E November 1998 – October 2022 CD54HC374 , CD54HC574 , CD54HCT374 , CD54HCT574 , CD74HC374 , CD74HC574 , CD74HCT374 , CD74HCT574
PRODUCTION DATA
- 1 特性
- 2 說明
- 3 Revision History
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Power Supply Recommendations
- 9 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- J|20
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
2 說明
’HC374、’HCT374、’HC574 和 ’HCT574 是八路 D 型觸發(fā)器，具有三態(tài)輸出，能夠驅(qū)動 15 個 LSTTL 負(fù)載。八個邊沿觸發(fā)式觸發(fā)器在時鐘 (CP) 從低電平向高電平轉(zhuǎn)換時將數(shù)據(jù)輸入其寄存器。輸出使能端 (OE) 控制三態(tài)輸出，不受寄存器操作的影響。當(dāng) OE 為高電平時，輸出處于高阻態(tài)。374 和 574 功能相同，只是引腳排列方式不同。
器件信息
| 器件型號 | 封裝(1) | 封裝尺寸（標(biāo)稱值） |
|---|---|---|
| CD54HC374F3A | CDIP (20) | 26.92mm × 6.92mm |
| CD54HC574F | CDIP (20) | 26.92mm × 6.92mm |
| CD54HCT374F3A | CDIP (20) | 26.92mm × 6.92mm |
| CD54HCT574F | CDIP (20) | 26.92mm × 6.92mm |
| CD74HC374M | SOIC (20) | 12.80mm × 7.50mm |
| CD74HC574M | SOIC (20) | 12.80mm × 7.50mm |
| CD74HCT374M | SOIC (20) | 12.80mm × 7.50mm |
| CD74HCT574M | SOIC (20) | 12.80mm × 7.50mm |
| CD74HC374E | PDIP (20) | 25.40mm × 6.35mm |
| CD74HC574E | PDIP (20) | 25.40mm × 6.35mm |
| CD74HCT374E | PDIP (20) | 25.40mm × 6.35mm |
| CD74HCT574E | PDIP (20) | 25.40mm × 6.35mm |
| CD74HCT574PWR | TSSOP (20) | 6.50mm × 4.40mm |
(1) 如需了解所有可用封裝，請參閱數(shù)據(jù)表末尾的可訂購產(chǎn)品附錄。
功能圖