SBASAR8 November 2025 AMC0300D-Q1
PRODMIX
| THERMAL METRIC(1) | D (SOIC) | UNIT | |
|---|---|---|---|
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 19.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 58.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |