SBASAR8 November 2025 AMC0300D-Q1
PRODMIX
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information?(D Package)
- 6.5 Thermal Information?(DWV Package)
- 6.6 Power Ratings?
- 6.7 Insulation Specifications (Basic Isolation)
- 6.8 Insulation Specifications (Reinforced Isolation)
- 6.9 Safety-Related Certifications (Basic Isolation)
- 6.10 Safety-Related Certifications (Reinforced Isolation)
- 6.11 Safety Limiting Values (D Package)
- 6.12 Safety Limiting Values (DWV Package)
- 6.13 Electrical Characteristics
- 6.14 Switching Characteristics
- 6.15 Timing Diagram
- 6.16 Insulation Characteristics Curves
- 6.17 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DWV|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
5 Pin Configuration and Functions
Figure 5-1 DWV
and D Packages, 8-Pin
SOIC (Top View)Table 5-1 Pin Functions
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | VDD1 | High-side power | High-side power supply(1) |
| 2 | INP | Analog input | Noninverting analog input(2) |
| 3 | INN | Analog Input | Inverting analog input(2) |
| 4 | GND1 | High-side ground | High-side analog ground |
| 5 | GND2 | Low-side ground | Low-side analog ground |
| 6 | OUTN | Analog output | Inverting analog output |
| 7 | OUTP | Analog output | Noninverting analog output |
| 8 | VDD2 | Low-side power | Low-side power supply(1) |
(1) See the Power Supply Recommendations section for power-supply decoupling recommendations.
(2) See the Input Filter Design section for input filter design.