ZHCSPO2 September   2023 ADC32RF52

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說(shuō)明
5. 4 Revision History
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics - Power Consumption
   6. 6.6  Electrical Characteristics - DC Specifications
   7. 6.7  Electrical Characteristics - AC Specifications (Dither DISABLED)
   8. 6.8  Electrical Characteristics - AC Specifications (Dither ENABLED)
   9. 6.9  Timing Requirements
   10. 6.10 Typical Characteristics
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 功能方框圖
   3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
         1. 7.3.1.1 Input Bandwidth and Full-Scale
         2. 7.3.1.2 Input Imbalance
         3. 7.3.1.3 Overrange Indication
         4. 7.3.1.4 Analog out-of-band dither
      2. 7.3.2 Sampling Clock Input
      3. 7.3.3 SYSREF
         1. 7.3.3.1 SYSREF Capture Detection
      4. 7.3.4 ADC Foreground Calibration
         1. 7.3.4.1 Calibration Control
         2. 7.3.4.2 ADC Switch
         3. 7.3.4.3 Calibration Configuration
      5. 7.3.5 Decimation Filter
         1. 7.3.5.1 Decimation Filter Response
         2. 7.3.5.2 Decimation Filter Configuration
         3. 7.3.5.3 20-bit Output Mode
         4. 7.3.5.4 Dynamic Switching
            1. 7.3.5.4.1 2 Lane Mode
            2. 7.3.5.4.2 1 Lane Mode
         5. 7.3.5.5 Numerically Controlled Oscillator (NCO)
         6. 7.3.5.6 NCO Frequency Programming
         7. 7.3.5.7 Fast Frequency Hopping
            1. 7.3.5.7.1 Fast frequency hopping using the GPIO1/2 pins
            2. 7.3.5.7.2 Fast frequency hopping using GPIO1/2, SEN and SDATA pins
            3. 7.3.5.7.3 Fast frequency hopping using the fast SPI
      6. 7.3.6 JESD204B Interface
         1. 7.3.6.1 JESD204B Initial Lane Alignment (ILA)
            1. 7.3.6.1.1 SYNC Signal
         2. 7.3.6.2 JESD204B Frame Assembly
         3. 7.3.6.3 JESD204B Frame Assembly in Bypass Mode
         4. 7.3.6.4 JESD204B Frame Assembly with Complex Decimation - Single Band
         5. 7.3.6.5 JESD204B Frame Assembly with Complex Decimation - Dual Band
         6. 7.3.6.6 JESD204B Frame Assembly with Complex Decimation - Quad Band
      7. 7.3.7 SERDES Output MUX
      8. 7.3.8 Test Pattern
         1. 7.3.8.1 Transport Layer
         2. 7.3.8.2 Link Layer
         3. 7.3.8.3 Internal Capture Memory Buffer
   4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Averaging
   5. 7.5 Programming
      1. 7.5.1 GPIO Pin Control
      2. 7.5.2 Configuration using the SPI interface
         1. 7.5.2.1 Register Write
         2. 7.5.2.2 Register Read
   6. 7.6 Register Maps
      1. 7.6.1 Detailed Register Description
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
         1. 8.2.1.1 Design Requirements
            1. 8.2.1.1.1 Input Signal Path
            2. 8.2.1.1.2 Clocking
         2. 8.2.1.2 Detailed Design Procedure
            1. 8.2.1.2.1 Sampling Clock
         3. 8.2.1.3 Application Curves
   3. 8.3 Initialization Set Up
      1. 8.3.1 Initial Device Configuration After Power-Up
         1. 8.3.1.1  STEP 1: RESET
         2. 8.3.1.2  STEP 2: Device Configuration
         3. 8.3.1.3  STEP 3: JESD Interface Configuration (1)
         4. 8.3.1.4  STEP 4: SYSREF Synchronization
         5. 8.3.1.5  STEP 5: JESD Interface Configuration (2)
         6. 8.3.1.6  STEP 6: Analog Trim Settings
         7. 8.3.1.7  STEP 7: Calibration Configuration
         8. 8.3.1.8  STEP 8: SYSREF Synchronization
         9. 8.3.1.9  STEP 9: Run Power up Calibration
         10. 8.3.1.10 STEP 10: JESD Interface Synchronization
   4. 8.4 Power Supply Recommendations
   5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
10. 9 Device and Documentation Support
    1. 9.1 接收文檔更新通知
    2. 9.2 支持資源
    3. 9.3 Trademarks
    4. 9.4 靜電放電警告
    5. 9.5 術(shù)語(yǔ)表
11. 10Mechanical, Packaging, and Orderable Information