CD54HCT74

正在供貨

具有設置和復位的高速 CMOS 邏輯雙通道上升沿 D 觸發(fā)器

產(chǎn)品詳情

Number of channels 2 Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 13 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (μA) 160 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 2 Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 13 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (μA) 160 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 14 130.4652 mm2 19.56 x 6.67
  • LSTTL input logic compatible
    • VIL(max) = 0.8 V, VIH(min) = 2 V
  • CMOS input logic compatible
    • II ≤ 1 μA at VOL, VOH
  • Buffered inputs
  • 4.5 V to 5.5 V operation
  • Wide operating temperature range: -55°C to +125°C
  • Supports fanout up to 10 LSTTL loads
  • Significant power reduction compared to LSTTL logic ICs
  • LSTTL input logic compatible
    • VIL(max) = 0.8 V, VIH(min) = 2 V
  • CMOS input logic compatible
    • II ≤ 1 μA at VOL, VOH
  • Buffered inputs
  • 4.5 V to 5.5 V operation
  • Wide operating temperature range: -55°C to +125°C
  • Supports fanout up to 10 LSTTL loads
  • Significant power reduction compared to LSTTL logic ICs

The CDx4HCT74-Q1 devices contain two independent D-type positive-edge-triggered flip-flops with asynchronous preset and clear pins for each.

The CDx4HCT74-Q1 devices contain two independent D-type positive-edge-triggered flip-flops with asynchronous preset and clear pins for each.
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類型 標題 下載最新的英語版本 日期
* 數(shù)據(jù)表 具有置位和復位上升沿觸發(fā)器的 CD54HCT74、CD74HCT74 二路 D 類觸發(fā)器 數(shù)據(jù)表 2019年 8月 30日

訂購和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點
  • 封裝廠地點

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