SLVUDF9 October 2025 TRF3302
3.2.1 PCB Stack-Up and Material
The EVM board dimensions are 1300 mil by 1070 mil, thickness is 60.5-mil, 4-layer board with material type Isola? 370HR as shown in Figure 3-8. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at nominal 50Ω. The bottom three layers are ground layers.
Figure 3-8 EVM Stack-Up (Units in Mils)